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Vision & Aim
Technical objectives
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Technical objectives

The overall objective of the FIREFLY project is the integration of nano-structured materials into hierarchically structured components that will be used for efficient light shaping and waveguiding of light in Photonic Circuits and the production process to make them.
In order to reach this main objective a number of material and process innovations will be generated, described in the following sub-objectives:

  1. Design & modelling of 3D photonic structures that can be manufactured. The final layout of the functional PIC must show functionality, manufacturability and applicability.

  2. Silicon polymers, having a tuneable refractive index and low optical loss and UV curable. The material must be suitable for implementation in the nano-imprint process to generate the structures of sub-objective 1. (figure 1)

  3. High refractive index, very monodisperse inorganic particles for the photonic structures, and Erbium doped nanoparticles for the active waveguide.

  4. Highly accurate production of nanostructures on flat substrates. The structured area must be high enough to show the functionality of waveguiding and bending.

  5. Multilayer stacking process for the production of 3D systems. The alignment accuracy must be sufficient to produce the required 3D structures. (figure 2)

  6. Accurate deposition processes of particles and polymers: The polymers and/or particles must be deposited in the nanostructured surfaces.

  7. Integration of multi-components into a functional board level Photonic Circuit: The goal is a production process deploying efficient assembly steps and accomplishing maximum functionality.

   

 

Figure 1: The functional board level PIC that will be made for the demonstration of the optical components.  

 

   

 

Figure 2. Two concepts for the nanostructured components to be developed in FIREFLY.